Wafer-Scale Multichip Packaging Technology

Wayne Johnson; R.C. Jaeger; Travis N. Blalock

doi:10.1007/978-1-4613-1621-3_10

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Wafer-Scale Multichip Packaging Technology

Wayne Johnson R.C. Jaeger Travis N. Blalock

Year: 1989 Pages: 473-499

DOI: 10.1007/978-1-4613-1621-3_10

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Keywords:

Wafer Wafer-scale integration Substrate (aquarium) Wafer-level packaging Table (database) Materials science Scale (ratio) Packaging engineering Optoelectronics Engineering Electronic engineering Computer science Mechanical engineering Database Physics Geology

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3.72

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0.89

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Topics

Semiconductor Lasers and Optical Devices

Physical Sciences → Engineering → Electrical and Electronic Engineering

3D IC and TSV technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Nanofabrication and Lithography Techniques

Physical Sciences → Engineering → Biomedical Engineering

Wafer-Scale Multichip Packaging Technology

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Citation History

Topics

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