Multichip packaging technology with laser-patterned interconnects

Abstract

A multichip silicon-on-silicon packaging technology has been developed which incorporates laser-patterned thin-film interconnects. This technology is particularly suited for application in high-speed, high-power, and high-I/O systems, where its unique characteristics provide many advantages over more traditional methods. The laser-patterned thin-film interconnects allow higher I/O densities and better electrical performance than wire bonds or TAB (tape automated bonding). The face-up, thin-film eutectic die attach technique used provides much lower thermal resistance between the substrate and the chips than can be achieved with solder bump die attach. In addition, laser-patterned interconnects demonstrate superior ruggedness and fatigue resistance under thermomechanical cycling and shock. This technology has been used to produce a ten-chip memory module, samples of which have been subjected to testing by means of relevant methods of MIL-STD 883C.< >