JOURNAL ARTICLE

Abstract: Effect of microstructure on interdiffusion in bimetallic Cu–Ni thin films

B. C. JohnsonC. BauerA.G. Jordan

Year: 1979 Journal:   Journal of Vacuum Science and Technology Vol: 16 (2)Pages: 128-129   Publisher: American Institute of Physics

Abstract

First Page

Keywords:
Microstructure Bimetallic strip Materials science Thin film Metallurgy Nanotechnology Metal

Metrics

5
Cited By
0.34
FWCI (Field Weighted Citation Impact)
0
Refs
0.57
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Topics

Copper Interconnects and Reliability
Physical Sciences →  Materials Science →  Electronic, Optical and Magnetic Materials
Metal and Thin Film Mechanics
Physical Sciences →  Engineering →  Mechanics of Materials
Electronic Packaging and Soldering Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering

Related Documents

JOURNAL ARTICLE

Summary Abstract: Auger study of interdiffusion in Cu/Ni thin films

John E. LewisPaul S. Ho

Journal:   Journal of Vacuum Science and Technology Year: 1982 Vol: 20 (3)Pages: 466-466
JOURNAL ARTICLE

Interdiffusion and reaction in bimetallic Cu-Sn thin films

K. N. Tu

Journal:   Acta Metallurgica Year: 1973 Vol: 21 (4)Pages: 347-354
JOURNAL ARTICLE

Low temperature interdiffusion in Cu/Ni thin films

H. LefakisJ.F. CainPaul S. Ho

Journal:   Thin Solid Films Year: 1983 Vol: 101 (3)Pages: 207-218
JOURNAL ARTICLE

Recrystallization and interdiffusion in thin bimetallic films

E. J. MittemeijerA.M. Beers

Journal:   Thin Solid Films Year: 1980 Vol: 65 (1)Pages: 125-135
JOURNAL ARTICLE

X-ray diffraction study of interdiffusion in bimetallic Ag/Cu thin films

Masanori MurakamiD. Defontaine

Journal:   Journal of Applied Physics Year: 1976 Vol: 47 (7)Pages: 2857-2861
© 2026 ScienceGate Book Chapters — All rights reserved.