JOURNAL ARTICLE
Interdiffusion and reaction in bimetallic Cu-Sn thin films
Year: 1973 Journal: Acta Metallurgica Vol: 21 (4)Pages: 347-354 Publisher: University of Toronto Press
Keywords:
Materials science Bimetallic strip Intermetallic Whiskers Analytical Chemistry (journal) Thin film Whisker Phase (matter) Crystallography Metallurgy Composite material Nanotechnology Alloy Chemistry
Metrics
481
Cited By
4.18
FWCI (Field Weighted Citation Impact)
19
Refs
0.95
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Citation History
Topics
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Copper Interconnects and Reliability
Physical Sciences → Materials Science → Electronic, Optical and Magnetic Materials
Metallurgical and Alloy Processes
Physical Sciences → Materials Science → General Materials Science
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