JOURNAL ARTICLE
Low temperature interdiffusion in Cu/Ni thin films
Year: 1983 Journal: Thin Solid Films Vol: 101 (3)Pages: 207-218 Publisher: Elsevier BV
Keywords:
Auger electron spectroscopy Copper Analytical Chemistry (journal) Nickel Grain boundary Torr Thin film Annealing (glass) Grain boundary diffusion coefficient Sputtering Chemistry Materials science Metallurgy Microstructure Nanotechnology Thermodynamics
Metrics
37
Cited By
1.40
FWCI (Field Weighted Citation Impact)
20
Refs
0.76
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Citation History
Topics
Copper Interconnects and Reliability
Physical Sciences → Materials Science → Electronic, Optical and Magnetic Materials
Microstructure and mechanical properties
Physical Sciences → Materials Science → Materials Chemistry
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
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