Ti-doped copper nitride films deposited by cylindrical magnetron sputtering

Xiaoyan Fan; Zhiguo Wu; Guangzhao Zhang; Cuizhu Li; Baisong Geng; Huan LI; P.X. Yan

doi:10.1016/j.jallcom.2006.09.006

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Ti-doped copper nitride films deposited by cylindrical magnetron sputtering

Xiaoyan Fan Zhiguo Wu Guangzhao Zhang Cuizhu Li Baisong Geng Huan LI P.X. Yan

Year: 2006 Journal: Journal of Alloys and Compounds Vol: 440 (1-2)Pages: 254-258 Publisher: Elsevier BV

DOI: 10.1016/j.jallcom.2006.09.006

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Keywords:

Materials science Copper Doping Nitride Sputter deposition Electrical resistivity and conductivity Sputtering Cavity magnetron Metallurgy Band gap Composite material Thin film Mineralogy Optoelectronics Nanotechnology Layer (electronics) Chemistry

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ZnO doping and properties

Physical Sciences → Materials Science → Materials Chemistry

Copper-based nanomaterials and applications

Physical Sciences → Materials Science → Materials Chemistry

Gas Sensing Nanomaterials and Sensors

Physical Sciences → Engineering → Electrical and Electronic Engineering

Ti-doped copper nitride films deposited by cylindrical magnetron sputtering

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