Copper nitride films deposited by dc reactive magnetron sputtering

K. Venkata Subba Reddy; A. Sivasankar Reddy; P. Sreedhara Reddy; S. Uthanna

doi:10.1007/s10854-007-9120-0

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Copper nitride films deposited by dc reactive magnetron sputtering

K. Venkata Subba Reddy A. Sivasankar Reddy P. Sreedhara Reddy S. Uthanna

Year: 2007 Journal: Journal of Materials Science Materials in Electronics Vol: 18 (10)Pages: 1003-1008 Publisher: Springer Science+Business Media

DOI: 10.1007/s10854-007-9120-0

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Keywords:

Materials science Substrate (aquarium) Sputtering Crystallite Copper Sputter deposition Electrical resistivity and conductivity Nitride Indentation hardness Analytical Chemistry (journal) Thin film Metallurgy Composite material Microstructure Layer (electronics) Chemistry Nanotechnology Electrical engineering

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ZnO doping and properties

Physical Sciences → Materials Science → Materials Chemistry

Copper-based nanomaterials and applications

Physical Sciences → Materials Science → Materials Chemistry

Semiconductor materials and devices

Physical Sciences → Engineering → Electrical and Electronic Engineering

Copper nitride films deposited by dc reactive magnetron sputtering

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