JOURNAL ARTICLE

Microstructure of interfacial reaction layer in Sn–Ag–Cu/electroless Ni (P) solder joint

Han-Byul KangJee‐Hwan BaeJeong‐Won YoonSeung‐Boo JungJongwoo ParkCheol‐Woong Yang

Year: 2011 Journal:   Journal of Materials Science Materials in Electronics Vol: 22 (9)Pages: 1308-1312   Publisher: Springer Science+Business Media
Keywords:
Soldering Microstructure Materials science Layer (electronics) Joint (building) Metallurgy Composite material Structural engineering

Metrics

7
Cited By
0.71
FWCI (Field Weighted Citation Impact)
13
Refs
0.76
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Electronic Packaging and Soldering Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
3D IC and TSV technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Metallurgical and Alloy Processes
Physical Sciences →  Materials Science →  General Materials Science

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