Microstructure of interfacial reaction layer in Sn–Ag–Cu/electroless Ni (P) solder joint

Han-Byul Kang; Jee‐Hwan Bae; Jeong‐Won Yoon; Seung‐Boo Jung; Jongwoo Park; Cheol‐Woong Yang

doi:10.1007/s10854-011-0305-1

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Microstructure of interfacial reaction layer in Sn–Ag–Cu/electroless Ni (P) solder joint

Han-Byul Kang Jee‐Hwan Bae Jeong‐Won Yoon Seung‐Boo Jung Jongwoo Park Cheol‐Woong Yang

Year: 2011 Journal: Journal of Materials Science Materials in Electronics Vol: 22 (9)Pages: 1308-1312 Publisher: Springer Science+Business Media

DOI: 10.1007/s10854-011-0305-1

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Keywords:

Soldering Microstructure Materials science Layer (electronics) Joint (building) Metallurgy Composite material Structural engineering

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Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

3D IC and TSV technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Metallurgical and Alloy Processes

Physical Sciences → Materials Science → General Materials Science

Microstructure of interfacial reaction layer in Sn–Ag–Cu/electroless Ni (P) solder joint

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Citation History

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