Interfacial reaction between Sn-Ag solder and electroless Ni-Fe-P diffusion barriers with different internal microstructure

Li Liu; Lin Shi; Juan Peng; Jiang Bang; Shengfa Liu; Changqing Liu; Zhiwen Chen

doi:10.1016/j.materresbull.2022.111854

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Interfacial reaction between Sn-Ag solder and electroless Ni-Fe-P diffusion barriers with different internal microstructure

Li Liu Lin Shi Juan Peng Jiang Bang Shengfa Liu Changqing Liu Zhiwen Chen

Year: 2022 Journal: Materials Research Bulletin Vol: 152 Pages: 111854-111854 Publisher: Elsevier BV

DOI: 10.1016/j.materresbull.2022.111854

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Keywords:

Materials science Intermetallic Soldering Microstructure Diffusion barrier Diffusion Layer (electronics) Substrate (aquarium) Metallurgy Amorphous solid Barrier layer Coating Chemical engineering Composite material Alloy Crystallography Chemistry

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Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Semiconductor materials and interfaces

Physical Sciences → Physics and Astronomy → Atomic and Molecular Physics, and Optics

3D IC and TSV technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Interfacial reaction between Sn-Ag solder and electroless Ni-Fe-P diffusion barriers with different internal microstructure

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