This paper presents for the first time a piezoresistive poly-SiGe pressure sensor processed at temperatures compatible with above-CMOS integration. Despite the low processing temperature (max. 455°C), a sensitivity of 5.8mV/V/bar for a membrane of 200×200 μm 2 is reached by piezoresistor design optimization. The possibility of further enhancing the piezoresistive properties of SiGe by tuning annealing time is investigated, leading to a 30% improvement in gauge factor.
Pilar GonzalezBin GuoMichał RakowskiK. De MeyerAnn Witvrouw
V. MosserJ. SuskiJonathan P. GossΕ. Obermeier
Dongkyu JangYoonki HongSeongbin HongJong‐Ho Lee
R. P. SinghLow Lee NgoHo Soon SengF.N.C. Mok