Interfacial Reactions between Cu x Ni y Alloy Underbump Metallurgy and Sn-Ag-zCu Solders

Hyeuk Jin Han; Yoonchul Sohn; Jin Yu

doi:10.1007/s11664-006-0049-5

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Interfacial Reactions between Cu x Ni y Alloy Underbump Metallurgy and Sn-Ag-zCu Solders

Hyeuk Jin Han Yoonchul Sohn Jin Yu

Year: 2007 Journal: Journal of Electronic Materials Vol: 36 (5)Pages: 578-586 Publisher: Springer Science+Business Media

DOI: 10.1007/s11664-006-0049-5

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Keywords:

Intermetallic Soldering Alloy Materials science Metallurgy Copper Phase diagram Eutectic system Solid solution Ternary operation Phase (matter) Chemistry

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Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

3D IC and TSV technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Advanced Welding Techniques Analysis

Physical Sciences → Engineering → Mechanical Engineering

Interfacial Reactions between Cu x Ni y Alloy Underbump Metallurgy and Sn-Ag-zCu Solders

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Citation History

Topics

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