BOOK-CHAPTER

Interfacial Reaction between Sn-Ag Based Solders and Au/Ni Alloy Platings

Keisuke UenishiKojiro F. Kobayashi

Year: 2005 Materials science forum Pages: 411-416   Publisher: Trans Tech Publications
Keywords:
Materials science Metallurgy Alloy

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Topics

Electronic Packaging and Soldering Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering

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