BOOK-CHAPTER
Interfacial Reaction between Sn-Ag Based Solders and Au/Ni Alloy Platings
Keisuke UenishiKojiro F. Kobayashi
Year: 2005 Materials science forum Pages: 411-416 Publisher: Trans Tech Publications
Keywords:
Materials science Metallurgy Alloy
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Topics
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
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