JOURNAL ARTICLE
Interfacial Reactions Between Cu-Ag Alloy Substrates and Sn
Teng‐Kai YangChih-Fan LinChih‐Ming Chen
Year: 2014 Journal: Journal of Electronic Materials Vol: 44 (1)Pages: 511-517 Publisher: Springer Science+Business Media
Keywords:
Intermetallic Eutectic system Interphase Alloy Materials science Microstructure Phase (matter) Substrate (aquarium) Copper Metallurgy Chemical engineering Crystallography Chemistry
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1
Cited By
0.00
FWCI (Field Weighted Citation Impact)
18
Refs
0.07
Citation Normalized Percentile
Is in top 1%
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Citation History
Topics
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Aluminum Alloy Microstructure Properties
Physical Sciences → Engineering → Aerospace Engineering
Intermetallics and Advanced Alloy Properties
Physical Sciences → Engineering → Mechanical Engineering
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