Interfacial reactions between In 10Ag solders and Ag substrates

Y. M. Liu; Tung‐Han Chuang

doi:10.1007/s11664-000-0133-1

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Interfacial reactions between In 10Ag solders and Ag substrates

Y. M. Liu Tung‐Han Chuang

Year: 2000 Journal: Journal of Electronic Materials Vol: 29 (11)Pages: 1328-1332 Publisher: Springer Science+Business Media

DOI: 10.1007/s11664-000-0133-1

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Keywords:

Intermetallic Activation energy Wetting Arrhenius equation Materials science Kinetics Soldering Diffusion Solid-state physics Drop (telecommunication) Atmospheric temperature range Sessile drop technique Chemical engineering Metallurgy Chemistry Crystallography Thermodynamics Composite material Physical chemistry Alloy Condensed matter physics

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Topics

Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Intermetallics and Advanced Alloy Properties

Physical Sciences → Engineering → Mechanical Engineering

Metallurgical and Alloy Processes

Physical Sciences → Materials Science → General Materials Science

Interfacial reactions between In 10Ag solders and Ag substrates

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Citation History

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