Effects of ambient gas on the diffusion of copper through thin chromium films and of nickel through thin gold films

Sumit Kumar Ray; Ruthan Lewis

doi:10.1016/0040-6090(85)90140-3

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Effects of ambient gas on the diffusion of copper through thin chromium films and of nickel through thin gold films

Sumit Kumar Ray Ruthan Lewis

Year: 1985 Journal: Thin Solid Films Vol: 131 (3-4)Pages: 197-203 Publisher: Elsevier BV

DOI: 10.1016/0040-6090(85)90140-3

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Keywords:

Overlayer Copper Nickel Auger electron spectroscopy Chromium Wetting Thin film Materials science Metallurgy Diffusion Metal Chemistry Composite material Nanotechnology Physical chemistry

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Copper Interconnects and Reliability

Physical Sciences → Materials Science → Electronic, Optical and Magnetic Materials

Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Semiconductor materials and devices

Physical Sciences → Engineering → Electrical and Electronic Engineering

Effects of ambient gas on the diffusion of copper through thin chromium films and of nickel through thin gold films

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