Megasonic, Non-Contact Cleaning Followed by 'Rotagoni' Drying of CMP Wafers

Jeffrey M. Lauerhaas; Paul Mertens; Tom Nicolosi; Karine Kenis; Wim Fyen; Marc Heyns

doi:10.4028/www.scientific.net/ssp.76-77.251

ScienceGate Book Chapters

JOURNAL ARTICLE

Megasonic, Non-Contact Cleaning Followed by 'Rotagoni' Drying of CMP Wafers

Jeffrey M. Lauerhaas Paul Mertens Tom Nicolosi Karine Kenis Wim Fyen Marc Heyns

Year: 2001 Journal: Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena Vol: 76-77 Pages: 251-254 Publisher: Scientific.net

DOI: 10.4028/www.scientific.net/ssp.76-77.251

Get Full-Text PDF Get Analytical Report

Keywords:

Materials science Wafer Wet cleaning Composite material Nanotechnology Organic chemistry

Metrics

Cited By

0.99

FWCI (Field Weighted Citation Impact)

Refs

0.78

Citation Normalized Percentile

Is in top 1%

Is in top 10%

Citation History

Topics

Additive Manufacturing and 3D Printing Technologies

Physical Sciences → Engineering → Automotive Engineering

Megasonic, Non-Contact Cleaning Followed by 'Rotagoni' Drying of CMP Wafers

Metrics

Citation History

Topics

Related Documents

Single wafer cleaning and drying: particle removal via a non-contact, non-damaging megasonic clean followed by a high performance "Rotagoni" dry

Non-contact Post-CMP megasonic cleaning of cobalt wafers

Non-Contact Post Cu CMP Cleaning Using Megasonic Energy

Particle removal from semiconductor wafers by megasonic cleaning

Apparatus for uniform cleaning of wafers using megasonic energy