Microelectrode Tools Manufacturing by Hybrid Circuits Twin-Wire Electrodischarge Grinding

Abstract

This article describes a new hybrid machining process with combination twin-wire electrodischarge grinding (twin-WEDG) and two electrodischarge circuits to produce microelectrode tools rapidly. The results show that transistor and RC electrodischarge circuits could be jointly integrated into micro-EDM to shape microelectrode tools. Compared to conventional single WEDG technology, the twin-WEDG system utilizing both rough and finished machining combined into only one process can reduce machining time by two-thirds and achieve high efficiency when producing microtools. This high-speed microtool fabrication process can be applied not only to micro-electrode machining, but also to micropunching tool and microprobing tips machining.