Flexible tooling for localized electrochemical deposition with wire-electrodischarge grinding

Jian H. Choo; Song Huat Yeo; Fangyi Tan

doi:10.1007/s00542-003-0305-z

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Flexible tooling for localized electrochemical deposition with wire-electrodischarge grinding

Jian H. Choo Song Huat Yeo Fangyi Tan

Year: 2004 Journal: Microsystem Technologies Vol: 10 (2)Pages: 127-136 Publisher: Springer Science+Business Media

DOI: 10.1007/s00542-003-0305-z

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Keywords:

Anode Materials science Electroforming Cathode Electrode Composite material Deposition (geology) Fabrication Electrolysis Grinding Electrochemical machining Metallurgy Electrical engineering Electrolyte

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Advanced Machining and Optimization Techniques

Physical Sciences → Engineering → Electrical and Electronic Engineering

Electrodeposition and Electroless Coatings

Physical Sciences → Engineering → Electrical and Electronic Engineering

Advanced Surface Polishing Techniques

Physical Sciences → Engineering → Biomedical Engineering

Flexible tooling for localized electrochemical deposition with wire-electrodischarge grinding

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