Electrical performance and reliability evaluation of inkjet-printed Ag interconnections on paper substrates

Li Xie; Matti Mäntysalo; Ana López Cabezas; Yi Feng; Fredrik Jönsson; Lirong Zheng

doi:10.1016/j.matlet.2012.08.030

ScienceGate Book Chapters

JOURNAL ARTICLE

Electrical performance and reliability evaluation of inkjet-printed Ag interconnections on paper substrates

Li Xie Matti Mäntysalo Ana López Cabezas Yi Feng Fredrik Jönsson Lirong Zheng

Year: 2012 Journal: Materials Letters Vol: 88 Pages: 68-72 Publisher: Elsevier BV

DOI: 10.1016/j.matlet.2012.08.030

Get Full-Text PDF Get Analytical Report

Keywords:

Printed electronics Reliability (semiconductor) Electronics Substrate (aquarium) Materials science Electronic packaging Inkjet printing Flexible electronics Repeatability Inkwell Screen printing Nanotechnology Computer science Composite material Electrical engineering Engineering

Metrics

Cited By

3.06

FWCI (Field Weighted Citation Impact)

Refs

0.93

Citation Normalized Percentile

Is in top 1%

Is in top 10%

Citation History

Topics

Nanomaterials and Printing Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Advanced Sensor and Energy Harvesting Materials

Physical Sciences → Engineering → Biomedical Engineering

Electrical performance and reliability evaluation of inkjet-printed Ag interconnections on paper substrates

Metrics

Citation History

Topics

Related Documents

Electrical performance and reliability assessment of silver inkjet printed circuits on flexible substrates

Reliability of SMD interconnections on flexible low-temperature substrates with inkjet-printed conductors

Inkjet-printed Silver Tracks on Different Paper Substrates

Reliability of ICA attachment of SMDs on inkjet-printed substrates

Programmable Organic Chipless RFID Tags Inkjet Printed on Paper Substrates