Reliability of ICA attachment of SMDs on inkjet-printed substrates

Juha Niittynen; Janne Kiilunen; Jussi Putaala; Ville Pekkanen; Matti Mäntysalo; Heli Jantunen; Donald Lupo

doi:10.1016/j.microrel.2012.05.001

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Reliability of ICA attachment of SMDs on inkjet-printed substrates

Juha Niittynen Janne Kiilunen Jussi Putaala Ville Pekkanen Matti Mäntysalo Heli Jantunen Donald Lupo

Year: 2012 Journal: Microelectronics Reliability Vol: 52 (11)Pages: 2709-2715 Publisher: Elsevier BV

DOI: 10.1016/j.microrel.2012.05.001

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Keywords:

Printed electronics Reliability (semiconductor) Electronics Printed circuit board Flexible electronics Electrical conductor Adhesive Electronic component Component (thermodynamics) Inkjet printing Circuit reliability Materials science 3d printed Computer science Electrical engineering Nanotechnology Engineering Inkwell Manufacturing engineering Composite material Layer (electronics) Power (physics)

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Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

3D IC and TSV technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Nanomaterials and Printing Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Reliability of ICA attachment of SMDs on inkjet-printed substrates

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