JOURNAL ARTICLE

Reliability of ICA attachment of SMDs on inkjet-printed substrates

Keywords:
Printed electronics Reliability (semiconductor) Electronics Printed circuit board Flexible electronics Electrical conductor Adhesive Electronic component Component (thermodynamics) Inkjet printing Circuit reliability Materials science 3d printed Computer science Electrical engineering Nanotechnology Engineering Inkwell Manufacturing engineering Composite material Layer (electronics) Power (physics)

Metrics

34
Cited By
1.09
FWCI (Field Weighted Citation Impact)
24
Refs
0.81
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Electronic Packaging and Soldering Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
3D IC and TSV technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Nanomaterials and Printing Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering

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