Reliability of SMD interconnections on flexible low-temperature substrates with inkjet-printed conductors

Jussi Putaala; Jari Hannu; Esa Kunnari; Matti Mäntysalo; Olli Nousiainen; Heli Jantunen

doi:10.1016/j.microrel.2013.08.021

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Reliability of SMD interconnections on flexible low-temperature substrates with inkjet-printed conductors

Jussi Putaala Jari Hannu Esa Kunnari Matti Mäntysalo Olli Nousiainen Heli Jantunen

Year: 2013 Journal: Microelectronics Reliability Vol: 54 (1)Pages: 272-280 Publisher: Elsevier BV

DOI: 10.1016/j.microrel.2013.08.021

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Keywords:

Materials science Temperature cycling Interconnection Soldering Ceramic Composite material Resistor Curing (chemistry) Ball grid array Solder paste Electrical conductor Printed circuit board Computer science Electrical engineering Thermal Voltage

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Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

3D IC and TSV technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Electrical and Thermal Properties of Materials

Physical Sciences → Engineering → Electrical and Electronic Engineering

Reliability of SMD interconnections on flexible low-temperature substrates with inkjet-printed conductors

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