JOURNAL ARTICLE

Reliability of SMD interconnections on flexible low-temperature substrates with inkjet-printed conductors

Keywords:
Materials science Temperature cycling Interconnection Soldering Ceramic Composite material Resistor Curing (chemistry) Ball grid array Solder paste Electrical conductor Printed circuit board Computer science Electrical engineering Thermal Voltage

Metrics

20
Cited By
1.24
FWCI (Field Weighted Citation Impact)
18
Refs
0.83
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Electronic Packaging and Soldering Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
3D IC and TSV technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Electrical and Thermal Properties of Materials
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
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