Effect of a new pretreatment on the microstructure and thermal conductivity of Cu/diamond composites

Hua Bai; Nangang Ma; Jing Lang; Congxu Zhu

doi:10.1016/j.jallcom.2013.06.027

ScienceGate Book Chapters

JOURNAL ARTICLE

Effect of a new pretreatment on the microstructure and thermal conductivity of Cu/diamond composites

Hua Bai Nangang Ma Jing Lang Congxu Zhu

Year: 2013 Journal: Journal of Alloys and Compounds Vol: 580 Pages: 382-385 Publisher: Elsevier BV

DOI: 10.1016/j.jallcom.2013.06.027

Get Full-Text PDF Get Analytical Report

Keywords:

Diamond Spark plasma sintering Materials science Microstructure Thermal conductivity Composite material Sintering Carbide Particle (ecology) Material properties of diamond Copper Particle size Metallurgy Chemical engineering

Metrics

Cited By

3.17

FWCI (Field Weighted Citation Impact)

Refs

0.91

Citation Normalized Percentile

Is in top 1%

Is in top 10%

Citation History

Topics

Aluminum Alloys Composites Properties

Physical Sciences → Engineering → Mechanical Engineering

Advanced materials and composites

Physical Sciences → Engineering → Mechanical Engineering

Advanced ceramic materials synthesis

Physical Sciences → Materials Science → Ceramics and Composites

Effect of a new pretreatment on the microstructure and thermal conductivity of Cu/diamond composites

Metrics

Citation History

Topics

Related Documents

Microstructure and thermal conductivity of Cu–B/diamond composites

Thermal conductivity of Cu/diamond composites prepared by a new pretreatment of diamond powder

Effect of carbide formers on microstructure and thermal conductivity of diamond-Cu composites for heat sink materials

On the thermal conductivity of Cu–Zr/diamond composites

Interfacial microstructure and its effect on thermal conductivity of SiCp/Cu composites