Thermal conductivity of Cu/diamond composites prepared by a new pretreatment of diamond powder

Hua Bai; Nangang Ma; Jing Lang; Congxu Zhu; Yi Ma

doi:10.1016/j.compositesb.2013.04.017

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Thermal conductivity of Cu/diamond composites prepared by a new pretreatment of diamond powder

Hua Bai Nangang Ma Jing Lang Congxu Zhu Yi Ma

Year: 2013 Journal: Composites Part B Engineering Vol: 52 Pages: 182-186 Publisher: Elsevier BV

DOI: 10.1016/j.compositesb.2013.04.017

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Keywords:

Diamond Spark plasma sintering Materials science Thermal conductivity Tungsten carbide Composite material Copper Sintering Tungsten Particle (ecology) Composite number Particle size Metallurgy Chemical engineering

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Aluminum Alloys Composites Properties

Physical Sciences → Engineering → Mechanical Engineering

Advanced materials and composites

Physical Sciences → Engineering → Mechanical Engineering

Advanced ceramic materials synthesis

Physical Sciences → Materials Science → Ceramics and Composites

Thermal conductivity of Cu/diamond composites prepared by a new pretreatment of diamond powder

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