Effect of carbide formers on microstructure and thermal conductivity of diamond-Cu composites for heat sink materials

Yang Xia; Yue-qing SONG; Chenguang Lin; Cui Shun; Fang Zhen-zheng

doi:10.1016/s1003-6326(08)60422-7

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Effect of carbide formers on microstructure and thermal conductivity of diamond-Cu composites for heat sink materials

Yang Xia Yue-qing SONG Chenguang Lin Cui Shun Fang Zhen-zheng

Year: 2009 Journal: Transactions of Nonferrous Metals Society of China Vol: 19 (5)Pages: 1161-1166 Publisher: Elsevier BV

DOI: 10.1016/s1003-6326(08)60422-7

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Keywords:

Diamond Materials science Thermal conductivity Microstructure Composite material Carbide Alloy Interfacial thermal resistance Material properties of diamond Copper Layer (electronics) Powder metallurgy Metallurgy Thermal resistance Thermal

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Aluminum Alloys Composites Properties

Physical Sciences → Engineering → Mechanical Engineering

Tunneling and Rock Mechanics

Physical Sciences → Engineering → Civil and Structural Engineering

Advanced materials and composites

Physical Sciences → Engineering → Mechanical Engineering

Effect of carbide formers on microstructure and thermal conductivity of diamond-Cu composites for heat sink materials

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