FABRICATION OF CHIP SCALE PIEZORESISTIVE PRESSURE SENSORS USING SCREEN-PRINTED GLASS FRIT PACKAGING

Ciprian Iliescu; Jianmin Miao; Marioara Avram

doi:10.1142/s146587630300123x

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FABRICATION OF CHIP SCALE PIEZORESISTIVE PRESSURE SENSORS USING SCREEN-PRINTED GLASS FRIT PACKAGING

Ciprian Iliescu Jianmin Miao Marioara Avram

Year: 2003 Journal: International Journal of Computational Engineering Science Vol: 04 (02)Pages: 343-346 Publisher: Imperial College Press

DOI: 10.1142/s146587630300123x

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Keywords:

Frit Piezoresistive effect Wafer Materials science Pressure sensor Chemical-mechanical planarization Fan-out Microelectromechanical systems Mechanical engineering Composite material Optoelectronics Electrical engineering Engineering Polishing

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Advanced MEMS and NEMS Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Advanced Sensor and Energy Harvesting Materials

Physical Sciences → Engineering → Biomedical Engineering

Mechanical and Optical Resonators

Physical Sciences → Physics and Astronomy → Atomic and Molecular Physics, and Optics

FABRICATION OF CHIP SCALE PIEZORESISTIVE PRESSURE SENSORS USING SCREEN-PRINTED GLASS FRIT PACKAGING

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