JOURNAL ARTICLE

Study of the electrical contact resistance of multi-contact MEMS relays fabricated using the MetalMUMPs process

Lia AlmeidaRamesh RamadossRobert L. JacksonKoji IshikawaQuang YU

Year: 2006 Journal:   Journal of Micromechanics and Microengineering Vol: 16 (7)Pages: 1189-1194   Publisher: IOP Publishing

Abstract

The reliability of electrostatically actuated ohmic contact type MEMS relays has been investigated. Multi-contact MEMS relays laterally actuated using electrostatic comb-drive actuators were used in this study. The MEMS relays were fabricated using the MetalMUMPs process, which uses a 20 µm thick electroplated nickel as the structural layer. A 3 µm thick gold layer was electroplated on the electrical contact surfaces. An example MEMS relay with planar contacts of area 80 µm × 20 µm and spacing of 10 µm between the movable and fixed contacting surfaces is discussed. The overall size of the relay is approximately 3 mm × 3 mm. 'Resistance versus applied voltage' characteristics have been studied. At an applied dc bias voltage of 120 V, the movable fingers make initial contact with the fixed fingers. The 'resistance versus applied voltage' characteristics have been measured for an applied bias voltage in the range of 172–220 V. Reliability testing of the MEMS relay up to one million actuations has been carried out and the resistance degradation with actuation cycles is discussed.

Keywords:
Contact resistance Microelectromechanical systems Ohmic contact Materials science Relay Electroplating Electrical contacts Voltage Reliability (semiconductor) Actuator Optoelectronics Contact force Electrical engineering Layer (electronics) Composite material Electronic engineering Engineering

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60
Cited By
4.71
FWCI (Field Weighted Citation Impact)
28
Refs
0.95
Citation Normalized Percentile
Is in top 1%
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Citation History

Topics

Advanced MEMS and NEMS Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Acoustic Wave Resonator Technologies
Physical Sciences →  Engineering →  Biomedical Engineering
3D IC and TSV technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering

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