Reliability study of hermetic wafer level MEMS packaging with through-wafer interconnect

Sung‐Hoon Choa

doi:10.1007/s00542-009-0788-3

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Reliability study of hermetic wafer level MEMS packaging with through-wafer interconnect

Sung‐Hoon Choa

Year: 2009 Journal: Microsystem Technologies Vol: 15 (5)Pages: 677-686 Publisher: Springer Science+Business Media

DOI: 10.1007/s00542-009-0788-3

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Keywords:

Materials science Electroplating Microelectromechanical systems Interconnection Wafer Interposer Wafer-level packaging Soldering Electromigration Copper Fabrication Wafer testing Flip chip Eutectic bonding Void (composites) Electronic packaging Copper plating Composite material Optoelectronics Eutectic system Metallurgy Etching (microfabrication) Layer (electronics) Adhesive Computer science Alloy

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3D IC and TSV technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Copper Interconnects and Reliability

Physical Sciences → Materials Science → Electronic, Optical and Magnetic Materials

Reliability study of hermetic wafer level MEMS packaging with through-wafer interconnect

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