Hole drilling of silica glass with infrared femtosecond laser pulses

Abstract

Using water to reduce the redeposition of ablation debris, high precision holes, with diameter of 4 /spl mu/m and depth over 200 /spl mu/m, were drilled from the rear surface of silica glass with infrared femtosecond laser pulses. The long holes with very small diameters had a well-defined wall without obvious taper.