Abstract

High quality Si1~xGex p-channel MOSFETs have been fabricated in an integrable process using both thermal or PECVD gate oxides and selective UHV CVD for the Si/Si1 - x Gex channels. We show that optimally designed Si/Si1-xGex MOSFETs exhibit up to 7-% higher transconductance at 300K than control Si p-channel devices. Si/SiGe p-channel devices with thermal and PECVD gate oxides show comparable device characteristics.

Keywords:
Transconductance Materials science Optoelectronics MOSFET Channel (broadcasting) Plasma-enhanced chemical vapor deposition Silicon Thermal Electronic engineering Electrical engineering Transistor Physics Engineering

Metrics

19
Cited By
1.29
FWCI (Field Weighted Citation Impact)
2
Refs
0.79
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Topics

Advancements in Semiconductor Devices and Circuit Design
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Semiconductor materials and devices
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Silicon Carbide Semiconductor Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
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