High quality Si1~xGex p-channel MOSFETs have been fabricated in an integrable process using both thermal or PECVD gate oxides and selective UHV CVD for the Si/Si1 - x Gex channels. We show that optimally designed Si/Si1-xGex MOSFETs exhibit up to 7-% higher transconductance at 300K than control Si p-channel devices. Si/SiGe p-channel devices with thermal and PECVD gate oxides show comparable device characteristics.
Chia‐Yu ChenYang LiuJongchol KimR.W. Dutton
Sanghamitra DasTaraprasanna DashRajib Kumar NandaC. K. Maiti
Toshiyuki TsuchiyaYoshiyuki ImadaJ. Murota
L. X. YangJ.R. WatlingM. BoriçiR.C.W. WilkinsA. AsenovJohn R. BarkerS. Roy