BOOK-CHAPTER

Hybrid Wafer Scale Interconnections

D. HerrellH. Hashemi

Year: 1990 Frontiers of computer science Pages: 93-128   Publisher: Springer Nature
Keywords:
Interconnection Computer science Wafer Workstation Volume (thermodynamics) Semiconductor Electronic packaging Embedded system Electrical engineering Telecommunications Operating system Engineering

Metrics

1
Cited By
0.00
FWCI (Field Weighted Citation Impact)
16
Refs
0.09
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Topics

3D IC and TSV technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Copper Interconnects and Reliability
Physical Sciences →  Materials Science →  Electronic, Optical and Magnetic Materials
Electronic Packaging and Soldering Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering

Related Documents

JOURNAL ARTICLE

Optical Interconnections For Wafer-Scale Integrated And Hybrid-Wafer-Scale Integrated Architectures

Lawrence A. Hornak

Journal:   Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE Year: 1988 Vol: 0835 Pages: 322-322
JOURNAL ARTICLE

Multilevel interconnections for wafer scale integration

J. F. McDonaldA. J. StecklC. A. NeugebauerR. O. CarlsonA. S. Bergendahl

Journal:   Journal of Vacuum Science & Technology A Vacuum Surfaces and Films Year: 1986 Vol: 4 (6)Pages: 3127-3138
JOURNAL ARTICLE

Wafer scale interconnections for GaAs packaging — applications to RISC architecture

Journal:   Microprocessors and Microsystems Year: 1987 Vol: 11 (6)Pages: 339-339
© 2026 ScienceGate Book Chapters — All rights reserved.