Hybrid Wafer Scale Interconnections

D. Herrell; H. Hashemi

doi:10.1007/978-1-4613-0633-7_4

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Hybrid Wafer Scale Interconnections

D. Herrell H. Hashemi

Year: 1990 Frontiers of computer science Pages: 93-128 Publisher: Springer Nature

DOI: 10.1007/978-1-4613-0633-7_4

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Keywords:

Interconnection Computer science Wafer Workstation Volume (thermodynamics) Semiconductor Electronic packaging Embedded system Electrical engineering Telecommunications Operating system Engineering

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3D IC and TSV technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Copper Interconnects and Reliability

Physical Sciences → Materials Science → Electronic, Optical and Magnetic Materials

Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Hybrid Wafer Scale Interconnections

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