BOOK-CHAPTER
Cu Wafer Bonding for 3D IC Applications
Kuan‐Neng ChenChuan Seng TanAndy FanL. Rafael Reif
Year: 2008 Integrated circuits and systems Pages: 1-14 Publisher: Springer Nature
Keywords:
Wafer Materials science Wafer bonding Three-dimensional integrated circuit Optoelectronics Integrated circuit
Metrics
11
Cited By
2.34
FWCI (Field Weighted Citation Impact)
23
Refs
0.89
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Citation History
Topics
3D IC and TSV technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Additive Manufacturing and 3D Printing Technologies
Physical Sciences → Engineering → Automotive Engineering
Semiconductor materials and devices
Physical Sciences → Engineering → Electrical and Electronic Engineering
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