Advanced applications of wafer bonding

Abstract

Wafer bonding technology enables disparate crystalline materials to be layered for the fabrication of devices. Its application to high performance depleted CMOS, double gate CMOS and 3D device integration is discussed. The fabrication of photonic and optoelectronic devices, including light sources, light detectors, waveguides, couplers, switches and modulators, can also benefit from wafer bonding. Thin SOI, glass-bonded and twist bonded compliant substrate techniques are described.