Advanced joining techniques and their applications. Silicon wafer direct-bonding technique.

JOURNAL ARTICLE

Year: 1990 Journal: JOURNAL OF THE JAPAN WELDING SOCIETY Vol: 59 (2)Pages: 105-109

DOI: 10.2207/qjjws1943.59.105

Keywords:

Wafer Direct bonding Materials science Silicon Wafer bonding Optoelectronics Engineering physics Nanotechnology Engineering

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3D IC and TSV technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Advanced Surface Polishing Techniques

Physical Sciences → Engineering → Biomedical Engineering