BOOK-CHAPTER
Advanced Bonding/Joining Techniques
Keywords:
Anodic bonding Materials science Soldering Thermocompression bonding Adhesive Wire bonding Composite material Adhesive bonding Silicon Wafer bonding Bonding in solids Epoxy Electronic packaging Wafer Polymer Direct bonding Metallurgy Nanotechnology Layer (electronics) Chip
Metrics
4
Cited By
1.17
FWCI (Field Weighted Citation Impact)
87
Refs
0.81
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Citation History
Topics
3D IC and TSV technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Nanofabrication and Lithography Techniques
Physical Sciences → Engineering → Biomedical Engineering
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BOOK-CHAPTER
Advanced Bonding/Joining Techniques
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JOURNAL ARTICLE
Advanced joining techniques and their applications. Silicon wafer direct-bonding technique.
Journal: JOURNAL OF THE JAPAN WELDING SOCIETY Year: 1990 Vol: 59 (2)Pages: 105-109