Additively Manufactured in-Mold Electronics Reliability Under Thermal Cycling and Sustained High Temperature

Shriram Kulkarni; Aditya Harsha; Md Golam Sarwar; Pradeep Lall; Scott Miller

doi:10.1109/ectc51687.2025.00127

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JOURNAL ARTICLE

Additively Manufactured in-Mold Electronics Reliability Under Thermal Cycling and Sustained High Temperature

Shriram Kulkarni Aditya Harsha Md Golam Sarwar Pradeep Lall Scott Miller

Year: 2025 Pages: 718-725

DOI: 10.1109/ectc51687.2025.00127

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Keywords:

Temperature cycling Mold Reliability (semiconductor) Electronics Cycling Materials science Thermal Temperature measurement Reliability engineering Electrical engineering Composite material Engineering

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3.61

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Refs

0.86

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Is in top 10%

Citation History

Topics

Manufacturing Process and Optimization

Physical Sciences → Engineering → Industrial and Manufacturing Engineering

Additive Manufacturing and 3D Printing Technologies

Physical Sciences → Engineering → Automotive Engineering

Additive Manufacturing Materials and Processes

Physical Sciences → Engineering → Mechanical Engineering

Additively Manufactured in-Mold Electronics Reliability Under Thermal Cycling and Sustained High Temperature

Metrics

Citation History

Topics

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