JOURNAL ARTICLE

Additively Manufactured in-Mold Electronics Reliability Under Thermal Cycling and Sustained High Temperature

Keywords:
Temperature cycling Mold Reliability (semiconductor) Electronics Cycling Materials science Thermal Temperature measurement Reliability engineering Electrical engineering Composite material Engineering

Metrics

1
Cited By
3.61
FWCI (Field Weighted Citation Impact)
22
Refs
0.86
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Manufacturing Process and Optimization
Physical Sciences →  Engineering →  Industrial and Manufacturing Engineering
Additive Manufacturing and 3D Printing Technologies
Physical Sciences →  Engineering →  Automotive Engineering
Additive Manufacturing Materials and Processes
Physical Sciences →  Engineering →  Mechanical Engineering
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