JOURNAL ARTICLE
Screen-Printed Thermoformed Circuits Performance and Reliability under Sustained High Temperatures for In-Mold Electronics
Keywords:
Thermoforming Mold Electronics Reliability (semiconductor) Electronic circuit Printed circuit board Printed electronics Circuit reliability Electronic packaging Materials science Computer science Electronic engineering Electrical engineering Engineering Composite material
Metrics
4
Cited By
1.48
FWCI (Field Weighted Citation Impact)
12
Refs
0.77
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Citation History
Topics
3D IC and TSV technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Additive Manufacturing and 3D Printing Technologies
Physical Sciences → Engineering → Automotive Engineering
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JOURNAL ARTICLE
Performance and Reliability Comparison of Thermoformed, Screen-Printed Structures on Polycarbonate and High-Impact Polystyrene Substrates Under Sustained High Temperatures for In-Mold Electronics
Pradeep LallShriram KulkarniScott Miller
Journal: Journal of Electronic Packaging Year: 2025 Vol: 147 (4)