Performance and Reliability Comparison of Thermoformed, Screen-Printed Structures on Polycarbonate (PC) and High Impact Polystyrene (HIPS) Substrates Under Sustained High Temperatures for In-Mold Electronics

Abstract

Abstract In-mold electronics offers a path toward reducing the carbon footprint in automotive platforms through weight reduction. This technology enables the integration of human-machine interfaces directly onto automotive surfaces using additive printing processes. Among these processes, screen printing is a promising method due to its suitability for large surface areas and high throughput efficiency. This paper sets out to evaluate and compare the electrical and mechanical performance of additively screen-printed, thermoformed circuits on Polycarbonate (PC) and High Impact Polystyrene (HIPS) substrates under prolonged high temperatures. The research aims to characterize the long-term reliability and stability of these circuits under significant thermal stress and to analyze their failure modes and mechanisms. The methodology involves screen printing two types of test structures — Traces with Pads and Circuits — on both PC and HIPS substrates. In this paper, results are presented on SMD attachment of components on IME Circuits. The interaction of high-temperature processing with circuit performance has been studied.