JOURNAL ARTICLE

Fabrication of uniform submicron metal bump arrays based on undercut sacrificial layer for lift-off process

Zefeng LaiZhenyou ZouJinyu YeYibin LinXiongtu ZhouJie SunTailiang GuoChaoxing WuQun YanLei SunYongai Zhang

Year: 2025 Journal:   Journal of Materials Science Materials in Electronics Vol: 36 (12)   Publisher: Springer Science+Business Media
Keywords:
Undercut Materials science Fabrication Lift (data mining) Layer (electronics) Process (computing) Metal Nanotechnology Composite material Metallurgy Computer science

Metrics

1
Cited By
2.02
FWCI (Field Weighted Citation Impact)
35
Refs
0.75
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Electronic Packaging and Soldering Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
3D IC and TSV technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Nanomaterials and Printing Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering

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