Fabrication of uniform submicron metal bump arrays based on undercut sacrificial layer for lift-off process

Zefeng Lai; Zhenyou Zou; Jinyu Ye; Yibin Lin; Xiongtu Zhou; Jie Sun; Tailiang Guo; Chaoxing Wu; Qun Yan; Lei Sun; Yongai Zhang

doi:10.1007/s10854-025-14764-5

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Fabrication of uniform submicron metal bump arrays based on undercut sacrificial layer for lift-off process

Zefeng Lai Zhenyou Zou Jinyu Ye Yibin Lin Xiongtu Zhou Jie Sun Tailiang Guo Chaoxing Wu Qun Yan Lei Sun Yongai Zhang

Year: 2025 Journal: Journal of Materials Science Materials in Electronics Vol: 36 (12) Publisher: Springer Science+Business Media

DOI: 10.1007/s10854-025-14764-5

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Keywords:

Undercut Materials science Fabrication Lift (data mining) Layer (electronics) Process (computing) Metal Nanotechnology Composite material Metallurgy Computer science

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Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

3D IC and TSV technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Nanomaterials and Printing Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Fabrication of uniform submicron metal bump arrays based on undercut sacrificial layer for lift-off process

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