3D‐structured polymer composites using advanced templating strategies for EMI shielding

Abstract

Abstract The increasing use of electronic devices has become the widespread problem of electromagnetic interference (EMI), which can disrupt the normal functioning of electronic devices and pose threats to people health. To overcome this issue, the creation of efficient, portable, and affordable EMI shielding materials has become significant. 3D‐structured polymer composites have become extremely promising options because of their flexibility, easy processing, and high shielding performance over 2D traditional composites. A superior EMI shielding effectiveness highly depends on the arrangement of high‐conductivity fillers in the composites. This review focuses on the role of advanced templating techniques including sacrificial templating, ice templating, emulsion templating, and 3D printing for the fabrication of 3D interconnected fillers in composites that offer high EMI shielding performance. These unique templating techniques are crucial because they allow the formation of desired complex, hierarchical structures that improve the composites conductivity. By creating highly ordered and porous structures, these methods minimize the filler loading, improve filler dispersion, and optimize conductive pathways through increased porosity and surface area for effective interaction with electromagnetic waves. This review offers a helpful guidance for creating the next‐generation EMI shielding conductive polymer composites for various applications in aerospace, automotive, biomedical, and electronics industries. Highlights Fabrication of Lightweight 3D‐Structure Polymer Composites for superior EMI shielding. Optimized Filler Arrangement using advanced templating and 3D printing techniques. Enhanced Porosity and Surface Area for improved EMI shielding effectiveness. Challenges and Future Directions in developing lightweight, affordable, and efficient EMI shielding materials for the electronics industry.