Reliability of Direct Write Additively Printed Sustainable Flexible Circuitry With ECA Under Sustained High-Temperature Operation

Abstract

Abstract Companies are incorporating recycled materials, eco-friendly packaging, and energy-efficient designs to reduce their environmental footprint while maintaining performance and functionality. Direct write additive printing techniques have emerged as promising methods for fabricating sustainable electronics, offering advantages in terms of materials efficiency, design flexibility, and environmental friendliness. However, ensuring the reliability of these printed electronics under HTOL (High Temperature Operating Life) conditions remains a critical challenge. The HTOL test involves subjecting the device to temperatures significantly higher than its normal operating temperature. This elevated temperature accelerates the degradation processes within the device, allowing for quicker assessment of reliability. Identifying deficiencies in the current state of the art regarding the reliability of direct write additively printed sustainable flexible circuitry under HTOL conditions is crucial for guiding future development. The study focuses on evaluating the reliability of printed conductive traces and circuitry on sustainable, flexible substrates under sustained HTOL conditions. The morphology and microstructure of the conductive traces have also been studied using SEM and EDX. Insights from this research contribute to developing robust and environmentally friendly electronic devices suitable for a wide range of applications. Biodegradable polyethylene terephthalate (BPET) is used as substrate materials. The actual output of the printed circuitry before exposure to high temperature and during HTOL conditions is contrasted with the simulated performance of the circuit.