JOURNAL ARTICLE

Electromigration Reliability of SnAgCu Solder Joints in WLCSP

Keywords:
Electromigration Soldering Chip-scale package Reliability (semiconductor) Materials science Reliability engineering Metallurgy Composite material Engineering Optoelectronics

Metrics

1
Cited By
0.37
FWCI (Field Weighted Citation Impact)
7
Refs
0.56
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Electronic Packaging and Soldering Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
3D IC and TSV technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Copper Interconnects and Reliability
Physical Sciences →  Materials Science →  Electronic, Optical and Magnetic Materials

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