Electromigration Reliability of SnAgCu Solder Joints in WLCSP

Jiou Zhang; Xiu Zhang; Mengqi Liu; Fuyou Tian; Si Chen; Xiao Fei

doi:10.1109/icept63120.2024.10668659

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JOURNAL ARTICLE

Electromigration Reliability of SnAgCu Solder Joints in WLCSP

Jiou Zhang Xiu Zhang Mengqi Liu Fuyou Tian Si Chen Xiao Fei

Year: 2024 Pages: 1-6

DOI: 10.1109/icept63120.2024.10668659

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Keywords:

Electromigration Soldering Chip-scale package Reliability (semiconductor) Materials science Reliability engineering Metallurgy Composite material Engineering Optoelectronics

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Topics

Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

3D IC and TSV technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Copper Interconnects and Reliability

Physical Sciences → Materials Science → Electronic, Optical and Magnetic Materials

Electromigration Reliability of SnAgCu Solder Joints in WLCSP

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Citation History

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