Reliability testing of WLCSP lead-free solder joints

Huann-Wu Chiang; Junyuan Chen; Ming-Chuan Chen; Jeffrey C. B. Lee; Gary Shiau

doi:10.1007/bf02692564

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Reliability testing of WLCSP lead-free solder joints

Huann-Wu Chiang Junyuan Chen Ming-Chuan Chen Jeffrey C. B. Lee Gary Shiau

Year: 2006 Journal: Journal of Electronic Materials Vol: 35 (5)Pages: 1032-1040 Publisher: Springer Science+Business Media

DOI: 10.1007/bf02692564

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Keywords:

Soldering Materials science Temperature cycling Solderability Direct shear test Metallurgy Printed circuit board Composite material Chip-scale package Shear strength (soil) Scanning electron microscope Thermal shock Shear (geology) Wafer Thermal

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Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

3D IC and TSV technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Aluminum Alloys Composites Properties

Physical Sciences → Engineering → Mechanical Engineering

Reliability testing of WLCSP lead-free solder joints

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