Fabrication of High Aspect Ratio TSV Interposer with Cu-Cu Direct Bonding

JOURNAL ARTICLE

Year: 2024 Pages: 1-4

DOI: 10.1109/icept63120.2024.10668458

Keywords:

Interposer Fabrication Materials science Direct bonding Optoelectronics Nanotechnology Silicon Etching (microfabrication)

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0.37

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0.56

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3D IC and TSV technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Electronic Packaging and Soldering Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Additive Manufacturing and 3D Printing Technologies

Physical Sciences → Engineering → Automotive Engineering