Bonding of Cu-based high aspect ratio microscale structures with Sn intermediate layers

Fanghua Mei; Ke Chen; Bin Lü; W. J. Meng

doi:10.1007/s00542-009-0850-1

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Bonding of Cu-based high aspect ratio microscale structures with Sn intermediate layers

Fanghua Mei Ke Chen Bin Lü W. J. Meng

Year: 2009 Journal: Microsystem Technologies Vol: 15 (7)Pages: 1111-1118 Publisher: Springer Science+Business Media

DOI: 10.1007/s00542-009-0850-1

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Keywords:

Microscale chemistry Materials science Focused ion beam Ion Wire bonding Ultimate tensile strength Aspect ratio (aeronautics) Layer (electronics) Anodic bonding Composite material Nanotechnology Chemistry

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Electrowetting and Microfluidic Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Microfluidic and Capillary Electrophoresis Applications

Physical Sciences → Engineering → Biomedical Engineering

Nanofabrication and Lithography Techniques

Physical Sciences → Engineering → Biomedical Engineering

Bonding of Cu-based high aspect ratio microscale structures with Sn intermediate layers

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