Zhongling QianChristof Brillert
Abstract This chapter assesses the benefits of using a solid immersion lens (SIL) to detect faults in ICs via optical imaging and laser-stimulation techniques. It discusses the advantages and limitations of different types of SILs and their effect on spatial resolution, spot size, focus depth, and collection efficiency. It also provides a brief overview of technical challenges at the die level.
Zhongling QianChristof Brillert
Matthew J. LangTom D. MilsterTakahisa MinamitaniGregg T. Borek
Myun‐Sik KimToralf ScharfMohammad Tahdiul HaqWataru NakagawaHans Peter Herzig