JOURNAL ARTICLE

Inkjet printing electroless copper plating on aluminum nitride substrate

Chengwei LiuSifang LiShuangshuang WangShuaiou LuoHuidan ZengDeqiang Wang

Year: 2023 Journal:   Materials Today Communications Vol: 37 Pages: 107170-107170   Publisher: Elsevier BV
Keywords:
Materials science Copper Copper plating Substrate (aquarium) Ceramic Layer (electronics) Nitride Electrode Plating (geology) Composite material Metallurgy Electroplating

Metrics

2
Cited By
0.33
FWCI (Field Weighted Citation Impact)
19
Refs
0.55
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Nanomaterials and Printing Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering
Advanced Sensor and Energy Harvesting Materials
Physical Sciences →  Engineering →  Biomedical Engineering
Thermal properties of materials
Physical Sciences →  Materials Science →  Materials Chemistry
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