Inkjet printing electroless copper plating on aluminum nitride substrate

Chengwei Liu; Sifang Li; Shuangshuang Wang; Shuaiou Luo; Huidan Zeng; Deqiang Wang

doi:10.1016/j.mtcomm.2023.107170

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Inkjet printing electroless copper plating on aluminum nitride substrate

Chengwei Liu Sifang Li Shuangshuang Wang Shuaiou Luo Huidan Zeng Deqiang Wang

Year: 2023 Journal: Materials Today Communications Vol: 37 Pages: 107170-107170 Publisher: Elsevier BV

DOI: 10.1016/j.mtcomm.2023.107170

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Keywords:

Materials science Copper Copper plating Substrate (aquarium) Ceramic Layer (electronics) Nitride Electrode Plating (geology) Composite material Metallurgy Electroplating

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Nanomaterials and Printing Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Advanced Sensor and Energy Harvesting Materials

Physical Sciences → Engineering → Biomedical Engineering

Thermal properties of materials

Physical Sciences → Materials Science → Materials Chemistry

Inkjet printing electroless copper plating on aluminum nitride substrate

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