Nickel and copper conductive patterns fabricated by reactive inkjet printing combined with electroless plating

Dmitrii I. Petukhov; M. N. Kirikova; Alexander Bessonov; Marc J. A. Bailey

doi:10.1016/j.matlet.2014.06.109

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Nickel and copper conductive patterns fabricated by reactive inkjet printing combined with electroless plating

Dmitrii I. Petukhov M. N. Kirikova Alexander Bessonov Marc J. A. Bailey

Year: 2014 Journal: Materials Letters Vol: 132 Pages: 302-306 Publisher: Elsevier BV

DOI: 10.1016/j.matlet.2014.06.109

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Keywords:

Materials science Copper Layer (electronics) Nickel Substrate (aquarium) Plating (geology) Copper plating Fabrication Coating Electrical conductor Nanoparticle Adhesion Palladium Electrical resistivity and conductivity Reducing agent Metal Composite material Chemical engineering Nanotechnology Metallurgy Electroplating Catalysis Organic chemistry

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Nanomaterials and Printing Technologies

Physical Sciences → Engineering → Electrical and Electronic Engineering

Advanced Sensor and Energy Harvesting Materials

Physical Sciences → Engineering → Biomedical Engineering

Nanofabrication and Lithography Techniques

Physical Sciences → Engineering → Biomedical Engineering

Nickel and copper conductive patterns fabricated by reactive inkjet printing combined with electroless plating

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