JOURNAL ARTICLE

Resonant printing flexible piezoresistive pressure sensor with spherical microstructures

Zhiheng YuGuohong HuJian ChenFengli HuangYun ZhaoJijun Feng

Year: 2023 Journal:   Smart Materials and Structures Vol: 32 (3)Pages: 035020-035020   Publisher: IOP Publishing

Abstract

Abstract Flexible pressure sensors have attracted much attention in academia owing to their wide-ranging applications in wearable electronics, medical electronics and digital health. However, practical engineering applications have been restricted because of limitations in efficiency, manufacturing costs and sensitivity. In this work, we propose an innovative method for high-efficiency printing of microstructures that replaces traditional inverted mold methods. We developed a high-sensitivity flexible piezoresistive pressure (FPP) sensor with a high manufacturing efficiency and low manufacturing cost. The sensor was encapsulated by connecting a polydimethylsiloxane film with microstructures prepared using the sandpaper-molding method, and then integrated with an interdigital electrode and spherical micro-structures fabricated via resonant printing. In this way, the manufacturing process was simplified by breaking it down into two steps. The performance of the sensor was assessed by conducting experiments under different pressure regimes. The results demonstrated ultra-high sensitivity (0.0058–0.024 kPa −1 ) and a wide pressure detection range (1–100 kPa), spanning the entire range of pressure monitoring typically observed for vital and health signals. The response time of the sensor was less than 72 ms. Furthermore, the performance of the fabricated sensor was highly stable after 1000 bending cycle. The potential applications of the FPP sensor are discussed in area such as the human body and mouse.

Keywords:
Pressure sensor Piezoresistive effect Materials science Polydimethylsiloxane Electronics Printed electronics Sensitivity (control systems) Flexible electronics Molding (decorative) Nanotechnology Optoelectronics Wearable computer Electronic engineering Mechanical engineering Electrical engineering Inkwell Computer science Composite material Engineering Embedded system

Metrics

29
Cited By
4.61
FWCI (Field Weighted Citation Impact)
52
Refs
0.93
Citation Normalized Percentile
Is in top 1%
Is in top 10%

Citation History

Topics

Advanced Sensor and Energy Harvesting Materials
Physical Sciences →  Engineering →  Biomedical Engineering
Tactile and Sensory Interactions
Life Sciences →  Neuroscience →  Cognitive Neuroscience
Advanced MEMS and NEMS Technologies
Physical Sciences →  Engineering →  Electrical and Electronic Engineering

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