JOURNAL ARTICLE
Fatigue life of leadless chip carrier solder joints during power cycling
Year: 1985 Journal: Microelectronics Journal Vol: 16 (5)Pages: 49-49 Publisher: Elsevier BV
Keywords:
Power cycling Soldering Cycling Materials science Chip Temperature cycling Power (physics) Electrical engineering Structural engineering Engineering Composite material Reliability (semiconductor) Physics
Metrics
3
Cited By
0.00
FWCI (Field Weighted Citation Impact)
0
Refs
0.46
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Citation History
Topics
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
3D IC and TSV technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Advanced Welding Techniques Analysis
Physical Sciences → Engineering → Mechanical Engineering
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