JOURNAL ARTICLE
Fatigue life of leadless chip carrier solder joints during power cycling
Year: 1984 Journal: Microelectronics Reliability Vol: 24 (4)Pages: 806-806 Publisher: Elsevier BV
Keywords:
Soldering Power cycling Cycling Chip Temperature cycling Materials science Power (physics) Electrical engineering Engineering Automotive engineering Structural engineering Composite material Reliability (semiconductor) Physics
Metrics
8
Cited By
0.00
FWCI (Field Weighted Citation Impact)
0
Refs
0.44
Citation Normalized Percentile
Is in top 1%
Is in top 10%
Citation History
Topics
Electronic Packaging and Soldering Technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
3D IC and TSV technologies
Physical Sciences → Engineering → Electrical and Electronic Engineering
Aluminum Alloys Composites Properties
Physical Sciences → Engineering → Mechanical Engineering
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